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Open Interconnect Consortium : ウィキペディア英語版
Open Interconnect Consortium
The Open Interconnect Consortium (OIC) is an industry group whose stated mission is to develop standards and certification for devices involved in the Internet of Things (IoT) based around CoAP. OIC was created in July 2014 by Intel, Broadcom, and Samsung Electronics.〔(Intel, Samsung create Internet of Things group )〕 Broadcom left the consortium shortly after it was established, due to a disagreement on how to handle intellectual property.〔(It’s an IoT standards shakeup as Broadcom dumps Intel’s Open Interconnect Consortium )〕 Currently, there are more than 80 member companies including Cisco Systems, General Electric, Intel, MediaTek and Samsung.〔(List of OIC members )〕
The OIC tries to realize the Internet of Things also called Network of Everything. The IoT requires easy discovery, and trusted and reliable connectivity between things. The OIC delivers a framework that enables these requirements via a specification, a reference implementation and a certification program. IoTivity the open source reference implementation of the OIC specifications is actively developed by different members of the OIC.
In September 2015 a release candidate of the Specification in version 1.0 for the core framework, smart home device, resource type, security and remote access capabilities was released to the public, accessible also for non members without registration.〔(Candidate Specification 1.0 released )〕
==See Also==

* IoTivity - An open source reference implementation of the OIC specifications
* AllJoyn - A similar, competing industry consortium

抄文引用元・出典: フリー百科事典『 ウィキペディア(Wikipedia)
ウィキペディアで「Open Interconnect Consortium」の詳細全文を読む



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